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梁水保，男，工學博士，十大正規(guī)外圍平臺排名外圍買球app十大平臺副教授、碩士生導師、黃山學者學術(shù)骨干。2019年6月在華南理工大學獲工學博士學位，后于英國拉夫堡大學電子制造研究團隊從事博士后研究工作，2023年1月作為高層次人才引進加入十大正規(guī)外圍平臺排名，目前主要從事集成電路和電力電子中電子制造和電子封裝互連結(jié)構(gòu)在多物理場下微結(jié)構(gòu)特征及其可靠性影響的相關工作，迄今已參與了多項國家自然科學基金及英國工程與自然科學基金（EPSRC）項目，在微電子可靠性、應用物理、加工制造等領域共計發(fā)表學術(shù)論文50余篇，多次獲邀參加領域內(nèi)電子元器件及封裝可靠性類國際會議(ECTC、ESTC、ICEPT和ESREF等)和報道研究成果，曾獲最佳論文獎和杰出論文獎，獲邀擔任半導體與電子技術(shù)國際研討會(ISSET)技術(shù)委員會會員，更多相關信息及更新可參見：http://faculty.hfut.edu.cn/shuibao_liang

l   教育簡歷

2013 – 2019，華南理工大學，材料加工工程（微電子封裝及可靠性方向），博士

2017 – 2018，英國拉夫堡大學，電子制造與電子封裝，聯(lián)合培養(yǎng)博士

l  工作簡歷

2023/1 – 至今， 十大正規(guī)外圍平臺排名，外圍買球app十大平臺，副教授

2019 – 2022， 英國拉夫堡大學，機械電氣和制造工程學院，博士后

l  科學研究

主要研究興趣：半導體元器件封裝集成與可靠性工程。具體方向包括：(1) 先進封裝及功率器件中界面微結(jié)構(gòu)演化行為與服役可靠性評價；(2) 電力電子器件封裝熱-力可靠性研究；(3) 電子封裝互連結(jié)構(gòu)物理失效分析；(4) 微電子制造過程模擬仿真計算。

l  學術(shù)論文

[1] S.  Liang, H. Jiang, Z. Zhong, S. Ramachandran, Insights Into the Grain   Orientation Effect on Electromigration-Induced Failure in Solder  Interconnects Through Phase Field Modeling, IEEE Trans. Electron Devices (2023) DOI: 10.1109/TED.2023.3309280.

[2] S.   Liang, C. Liu, H. Jiang, Z. Zhong, Investigation of Electric-thermal-mechanical  Effects in Electric Assisted Silver Sintering Process through Phase Field  Modelling, IEEE Trans. Compon. Packag. Manuf. Technol. 99 (2023).

[3] S.   Liang, C. Wei, A. Kunwar, U. Subedi, H. Jiang, H. Ma, C. Ke, Phase field    modelling combined with data-driven approach to unravel the orientation   influenced growth of interfacial Cu₆Sn₅  intermetallics under electric current stressing, Surf. Interfaces (2023) 102728.

[4] S.  Liang, X.P. Zhang, Unraveling the electric field effect on the grain‐boundary   migration in alumina through phase field modeling, J. Am. Ceram. Soc. 106   (2023) 1647-1652.

[5] S.  Liang, M.B. Zhou, C. Ke, C. Wei, X.P. Zhang, Study of migration and    coalescence of voids driven by electric current stressing in solder   interconnects using phase field simulation, Microelectron. Reliab. 138    (2022) 114611.

[6] S.  Liang, Y. Zhong, S. Robertson, A. Liu, H. Jiang, C. Liu, Z. Zhou, C. Liu,   Investigation of thermal effect on solidification in Sn/Cu interconnects   during self-propagating exothermic reaction bonding, Microelectron. Reliab. 138 (2022) 114654.

[7] S. Liang, C. Wei, C. Ke, S. Cao, M.B. Zhou, X.P. Zhang, Investigation of the    Interaction Effect Between the Microstructure Evolution and the  Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via, IEEE Trans.  Device Mater. Reliab. 22 (2022) 267-275.

[8] S. Liang, C. Liu, Z. Zhou, Phase field study of grain boundary migration and  preferential growth in non-magnetic materials under magnetic field, Mater. Today Commun. 31 (2022) 103408.

[9] S. Liang, A. Kunwar, C. Liu, H. Jiang, Z. Zhou, Preferential growth of   intermetallics under temperature gradient at Cu–Sn interface during   transient liquid phase bonding: insights from phase field simulation, J.  Mater. Res. Technol. 19 (2022) 345-353.

[10] S.   Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, Thermo-mechanical   characteristics and reliability of die-attach through self-propagating   exothermic reaction bonding, IEEE Trans. Compon. Packag. Manuf. Technol.  11 (2021) 2122-2129.

[11] S.  Liang, A. Kunwar, C. Wei, C. Ke, Insight into the preferential grain   growth of intermetallics under electric current stressing–A phase field   modeling, Scr. Mater. 203 (2021) 114071.

[12] S.   Liang, C. Ke, C. Wei, J.Q. Huang, M.B. Zhou, X.P. Zhang, Microstructural   evolution and change in macroscopic physical properties of microscale   flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric  current stressing and elastic stress, J. Mater. Res. 34 (2019) 2775-2788.

[13] S.  Liang, C. Ke, C. Wei, M.B. Zhou, X.P. Zhang, Phase field modeling of   grain boundary migration and preferential grain growth driven by electric    current stressing, J. Appl. Phys. 124 (2018) 175109.

[14] S.   Liang, C. Ke, W. Ma, M.-B. Zhou, X.P. Zhang, Numerical simulations of   migration and coalescence behavior of microvoids driven by diffusion and   electric field in solder interconnects, Microelectron. Reliab. 71 (2017)   71-81.

l  會議報告

[1] 梁水保,       3D封裝微凸點焊點界面IMC在物理場下優(yōu)先生長的機制研究, 2023 電子封裝材料與測試技術(shù)創(chuàng)新大會, 貴陽, 中國, 10月20-22日, 2023, 邀請報告.

[2] S.       Liang, Y. Zhong, S. Robertson, A. Liu, Z. Zhou, C. Liu, Investigation of       thermo-mechanical and phase-change behavior in the Sn/Cu interconnects       during self-propagating exothermic reaction bonding, The 70th Electronic       Components and Technology Conference (ECTC), IEEE, Orlando, FL, USA, May.       30-Jun. 3, 2020, pp. 269-275.

[3] S.       Liang, C.Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of       Kirkendall voids at the interface of microscale Sn/Cu system lead-free       interconnects, The 15th International Conference on Electronic Packaging       Technology, IEEE, Chengdu, Aug. 12-15, 2014, pp. 641-645.

[4] S.       Liang, C. Ke, W.J. Ma, M.B. Zhou, X.P. Zhang, Phase field simulation of       segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects       under electric current stressing,  The 66th Electronic Components       and Technology Conference (ECTC), IEEE, Las Vegas, NV, USA, May. 31-Jun.       3, 2016, pp. 264-270.

[5] S.       Liang, C. Ke, M.Y. Tan, M.B. Zhou, X.P. Zhang, Phase field simulation of       the microstructural evolution and electromigration-induced phase       segregation in line-type Cu/Sn-Bi/Cu solder interconnects, The 17th       International Conference on Electronic Packaging Technology (ICEPT),       IEEE, Wuhan, Aug. 16-19, 2016, pp. 836-840.

[6] S.       Liang, X.P. Zhang, C. Wei, C. Ke, C. Liu, Interaction effects between the       preferred growth of β-Sn grains and thermo-mechanical response in       microbump interconnects under thermal cycling, The 7th Electronic       System-Integration Technology Conference (ESTC), IEEE, Dresden, Germany,       Sep. 18-21, 2018, pp. 1-7.

l  科研獲獎

[1] 2016年，第17屆電子封裝技術(shù)國際會議最佳學生論文獎 (Cisco & ASE Best Student Paper Award)，國際電氣電子工程師聯(lián)合會電子元件封裝和生產(chǎn)技術(shù)學會（IEEE-CPMT）、中國電子學會

[2] 2014年，第15屆電子封裝技術(shù)國際會議杰出論文獎       (JCAP Outstanding Paper Award)，國際電氣電子工程師聯(lián)合會電子元件封裝和生產(chǎn)技術(shù)學會（IEEE-CPMT）、中國電子學會