1.Hong-kai Zha, Jing-yang Yu, Jing-wei Li*, Yin-he Lin, Wen-qing Yu, Jian Shi*, Yu-hang Fan, Wen-ming Tang, Si3N4 preparation from photovoltaic kerf loss silicon waste by copper collaborative nitriding method [J], Ceramics International, 2024, https://doi.org/10.1016/j.ceramint.2024.04.429 2.Hong?kai Zha,Wen?qing Yu, Jing?wei Li*, Jian Shi*, Jun?cheng Li, Wen?ming Tang, Yin?he Lin, Kui?song Zhu, Ji-gui Cheng, Gui-cheng Liu, Progress in Preparation and Properties of Porous Silicon Nitride Ceramics[J], Silicon, 2023, 15, 6631-6653. 3.Jingwei Li*, Yinhe Lin*, Jian Shi, Boyuan Ban, Jifei Sun, Yong Ma, Fanmao Wang, Wei Lv, Jian Chen*, Recovery of high purity Si from kerf-loss Si slurry waste by flotation method using PEA collector[J], Waste Management, 2020, 115: 1-7. 4.Jingwei Li, Yinhe Lin*, Fanmao Wang, Jian Shi, Jifei Sun, Boyuan Ban, Guicheng Liu*, Jian Chen*, Progress in recovery and recycling of kerf loss silicon waste in photovoltaic industry[J], Separation and purification technology, 2021, 254: 117581. 5.Jingwei Li, Xiaolong Bai, Boyuan Ban, Qiuxiang He, Jian Chen*, Mechanism of boron removal from Si-Al melt by Ar-H2 gas mixtures[J], Transactions of Nonferrous Metals Society of China, 2016, 26: 3041-3056. 6.Jingwei Li, Zhancheng Guo*, Thermodynamic Evaluation of Segregation Behaviors of Metallic Impurities in Metallurgical Grade Silicon during Al-Si Solvent Refining Process[J], Journal of Crystal Growth, 2014, 394: 18-23. 7.Chen Chen, Boyuan Ban*, Jifei Sun, Jingwei Li*, Xuesong Jiang, Jian Shi, Jian Chen*, Jianbo Jia, Hassan Sakiani, Seyed Hadi Tabaian, Mechanism of boron removal of primary Si phases and morphology evolution of impurity phases during slow cooling solidification refining of Al-30wt.%Si alloy with Zr additions[J], Journal of Alloy and Compounds, 2020, 860:158517. 8.Jian Shi, Liangquan Sheng, Jingwei Li*, Guicheng Liu, Green synthesis of high-performance porous carbon coated silicon composite anode for lithium storage based on recycled silicon kerf waste, Journal of Alloys and Compounds, 2022, 919: 165854. 9.Chenchen Xu, Junwei Chen*, Yichao Wang, Jiongdi Wang, Yan Zhang, Jingwei Li*, Jun Xu*, K+-D oping Constructs High Quality Inorganic Sb2(S, Se)3 Semiconductor Film for Efficient Solar Cells with Inspiring Open Circuit Voltage [J], IEEE Electron Device Letters, 2024, DOI 10.1109/LED.2024.3394440 10. Juxuan Ding, Jifei Sun, Jingwei Li, Chen Chen, Xuesong Jiang, Zihan Wang, Xiaoxiao Zhu, Zhangchao Mo, Shuanghong Chen, Boyuan Ban,* and Jian Chen*, Facile Synthesis of 2D SiOx-3D Si Hybrid Anode Materials by Ca Modification Effect for Enhanced Lithium Storage Performance[J], Small, 2024, https://doi.org/10.1002/smll.20230934 11. 鄭瑞劍,魏鑫,張浩,湯志桓,許海仙,崔嵩,李京偉,湯文明, 電子封裝用高導(dǎo)熱AlN陶瓷基板研究進(jìn)展[J],中國陶瓷,2023,59(5)1-14+49. 12. 曾祥勇,許海仙,朱家旭,張浩,崔嵩,李京偉,湯文明,Ag-Cu-Ti系合金釬焊陶瓷覆銅基板界面結(jié)合強度研究進(jìn)展[J],陶瓷學(xué)報,2022,43(4)539-550. 13. 王安書,張智慧,張亞增,左秋霞,蔣雪松,班伯源,李京偉,陳健,花崗偉晶巖制備高純石英砂可行性研究[J],有色金屬(選礦部分),2022,(2)81-86. 14. 林銀河,李京偉,王哲,唐勇,程相魁,黃曉麗,鈦精礦重選分離含硅物相影響因素研究[J],硅酸鹽通報, 2021,40(6)2070-2074. 15. 梁金山,葉宇融,吳昊天,李京偉,李軍成,班伯源,陳晨,湯文明,陳健,冶金硅造渣精煉制備太陽級硅研究進(jìn)展[J],中國有色金屬學(xué)報,2023,33(2)504-520. ● 授權(quán)專利 [1] 李京偉,陳健,班伯源,史劍,一種從晶體硅切割廢料中回收高純硅和碳化硅的方法,中國發(fā)明專利, ZL201911231187 .5. [2] 李京偉, 陳健,班伯源,史劍,孫繼飛,曹佰來,一種硅材料除磷提純添加劑以及提純方法,中國發(fā)明專利, ZL201910850909.9. [3] 李京偉,陳健, 班伯源,孫繼飛,史劍, 曹佰來,一種用于硅材料低溫精煉除硼的造渣劑及其使用方法, 中國發(fā)明專利, ZL201910850825.5. [4] 李京偉,俞景陽,林銀河,查鴻凱,湯文明,一種硅廢料制備氮化硅的方法,中國發(fā)明專利,申請?zhí)? 202311708670.4. [5] 李京偉,吳自旺,查鴻凱,林銀河,俞景陽,湯文明,一種利用光伏硅廢料制備氮化硅的方法,中國發(fā)明專利,申請?zhí)? 202311708669.1. [6] 李京偉,庾文慶,林銀河,查鴻凱,韓運成,湯文明,羅來馬,應(yīng)用在深海極端環(huán)境下的放射源盒子及封裝結(jié)構(gòu)、電池,申請?zhí)? 202211236866.3. [7] 林銀河,佘雪峰,王哲,羅林根,尹國亮,程相奎,李京偉,一種去除鈦渣中非鈦雜質(zhì)的除雜裝置及其篩分設(shè)備,中國發(fā)明專利,ZL202110866434.X. [8] 林銀河,帥勇,蒲春雷,張晨洋,程相魁,喻星嵐,劉金川,孫樂飛,尹國亮,陳艷波,馬蘭,李京偉,黃輝勝,王哲,朱奎松,劉志芳,溫玉蓮,盧勤,黃泉金,一種鈦鐵礦降硅提質(zhì)的選礦工藝,中國發(fā)明專利,ZL202310188223.4. [9] 林銀河,張晨洋,尹國亮,鄧波,帥勇,朱勇,蔡郡倬,李雨軒,李呂華,蒲春雷,喻星嵐,李京偉,劉金川,師學(xué)峰,孫樂飛,陳艷波,馬蘭,朱奎松,劉志芳,黃泉金,李應(yīng)澤,邱勇,薛亮,彭聰,一種赤鐵礦的反浮選工藝,中國發(fā)明專利,ZL202311033011.5. [10] 林銀河,鄭彬,蒲春雷,王來信,佘雪峰,李京偉,尹國亮,劉松利,王哲,黃輝勝,程相魁,羅婭君,石文兵,高爐爐內(nèi)取樣裝置,中國發(fā)明專利,ZL202210758012.5. [11] 陳健,孫繼飛,史劍,班伯源,李京偉,交聯(lián)碳包覆介孔硅顆粒的電極材料及其制備方法,中國發(fā)明專利,ZL201910497677.3. ● 教學(xué)成果與獎勵 [1] 中國發(fā)明協(xié)會創(chuàng)業(yè)獎-創(chuàng)新獎一等獎,(2023) [2] 2022年指導(dǎo)本科生獲校級優(yōu)秀畢業(yè)論文 [3] 指導(dǎo)學(xué)生獲得全國大學(xué)生冶金科技競賽三等獎 (2020,2021優(yōu)秀指導(dǎo)教師 連續(xù)兩屆) [4] 中國發(fā)明協(xié)會創(chuàng)業(yè)獎-成果獎二等獎(2022) [5] 中國有色金屬優(yōu)秀科技論文獎二等獎, 中國有色金屬學(xué)會, (2020,排名第一). [6] 中國有色金屬科技論文二等獎, 中國有色金屬學(xué)會, (2014,排名第一). [7] 周浩偉等,2022年互聯(lián)網(wǎng)+大學(xué)生創(chuàng)新創(chuàng)業(yè)大賽校級 銀獎.
|